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Products> Ceramic Substrate> Bare Ceramic Substrate> Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate
Laser Cutting Alumina Ceramic Substrate

Laser Cutting Alumina Ceramic Substrate

  • $1-100 /Piece/Pieces

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  • Payment Type: T/T,Paypal,Western Union
  • Incoterm: FOB,CIF,FCA,EXW,DDU
  • Min. Order: 10 Piece/Pieces
  • Transportation: Ocean,Land,Air,Express
  • Port: Shenzhen
Supply Ability & Additional Information
Additional Information

PackagingExport carton

Productivity500,000 Pieces/month

TransportationOcean,Land,Air,Express

Place of OriginChina

Supply Ability500,000 Pieces/month

CertificateRoHS, REACH, ISO9001

HS Code8547100000

PortShenzhen

Payment TypeT/T,Paypal,Western Union

IncotermFOB,CIF,FCA,EXW,DDU

Product Attributes

Model No.Customized

BrandJinghui Ceramic

Place Of OriginChina

SpeciesCeramic Plates

ApplicationIndustrial Ceramic

MaterialAlumina Ceramic

Processing ServiceMoulding, Punching, Cutting

ColorWhite, Pink, Balck, Ivory

ToleranceBest To Be 0.01mm

CertificateISO9001:2015, SGS

ApplicationCeramic Liner Plate, Ceramic Circuit Board

FeaturesExcellent Insulation, Low Thermal Conductivity

Max. Overall LengthSquare substrate, 152mm

Precision ProcessLaser Cutting, Machining, Polishing

Packaging & Delivery
Selling Units: Piece/Pieces
Package Type: Export carton
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Product Description
Laser Cutting Alumina Ceramic Substrate In order to obtain some complex custom designs and shapes in the industrial field, laser cutting is the most popular high-precision secondary processing method of alumina Ceramic Substrates, which is a more cost-effective manufacturing method than CNC machining. Our Strength 1. Different patterns can be customized according to customer requirements. 2. Combine laser cutting with CNC machining to obtain higher dimensional accuracy. 3. The...
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