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Products> Ceramic Substrate> Bare Ceramic Substrate> High Thermal Conductivity Aluminum Nitride Ceramic Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Wafer

High Thermal Conductivity Aluminum Nitride Ceramic Wafer

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    • Payment Type: T/T,Paypal
    • Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
    • Min. Order: 1 Piece/Pieces
    • Transportation: Ocean,Land,Air
    • Port: Shenzhen,HongKong
    Supply Ability & Additional Information
    Additional Information

    PackagingExport carton

    Productivity100000 pieces/month

    TransportationOcean,Land,Air

    Place of OriginChina

    Supply Ability50000 pieces/month

    CertificateRoHS

    HS Code8547100000

    PortShenzhen,HongKong

    Payment TypeT/T,Paypal

    IncotermFOB,CFR,CIF,EXW,FCA,CPT,CIP

    Product Attributes

    Model No.Customized

    BrandJinghui ceramics

    ColorGray

    Precision ProcessFine Grinding, Machining

    ApplicationCeramic Waser, Ceramic Disc, Heat-sink Plate

    Min. Wall Thickness0.30mm

    MaterialAluminum Nitride

    Max. Size400mm

    FeaturesHigh Thermal Conductivity

    DensityHigher Than 3.3g/cm3

    Packaging & Delivery
    Selling Units: Piece/Pieces
    Package Type: Export carton

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    Product Description
    High Thermal Conductivity Aluminum Nitride Ceramic Wafer The specification of the AlN Ceramic Substrate 1. We are supplying with many round ceramic wafer, square & rectangular ceramic substrate 2. The typical thickness of wafer covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm 3. The biggest diameter of round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick 4. The max. side-length of square and rectangular ceramic wafer can be 400mm by 500mm 5. Surface treatment: it can be...
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