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Products> Ceramic Substrate> Bare Ceramic Substrate> Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer
Laser Cutting 1mm 96% Alumina Ceramic Wafer

Laser Cutting 1mm 96% Alumina Ceramic Wafer

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    • Payment Type: T/T,Paypal
    • Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW
    • Min. Order: 500 Piece/Pieces
    • Transportation: Land,Air,Express
    • Port: Shenzhen Port,Hongkong Port
    Supply Ability & Additional Information
    Additional Information

    PackagingExport carton

    Productivity100,000 pcs/month

    TransportationLand,Air,Express

    Place of OriginHunan,China

    Supply Ability500,000pcs/month

    CertificateRoHS,REACH

    HS Code8547100000

    PortShenzhen Port,Hongkong Port

    Payment TypeT/T,Paypal

    IncotermFOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW

    Product Attributes

    Model No.As per customer's specification

    BrandJinghui ceramics

    Place Of OriginChina

    Types OfDielectric Ceramics, Insulating Ceramics

    MaterialAlumina, Zirconia

    FeaturesExcellent Insulation, Heat Dissipation

    CertificateISO9001:2015, RoHS, REACH

    ToleranceThickness To Be 0.02mm After Lapping

    ColorWhite, Pink, Balck, Ivory Optional

    Purity Option94.4% 95%, 99% Or 99.5% Alumina

    Precision ProcessLapping,Laser Scribing and Cutting

    ApplicationFor Power Electronic Modules

    Packaging & Delivery
    Selling Units: Piece/Pieces
    Package Type: Export carton
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    Product Description
    Laser Cutting 1mm 96% Alumina Ceramic Wafer The description The Ceramic Wafer is made out of 96% aluminum oxide, but 99%, 99.6% purity optional as per specific application's requirement. The regular forming process is type casting when the thickness of Ceramic Substrate less than 1.2mm. It's easy to achieve the different pattern, different shape with high dimensional accurancy by laser cutting, laser scribing. On the other hand, the forming process will be dry pressing and isostatic...
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