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Laser Cutting 1mm 96% Alumina Ceramic Wafer

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option	Alumina Ceramic wafer AlN, ZrO2, Si3N4 ceramic available Standard and customized specification Offer post-processing service Min. thickness to be 0.11mm
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Payment Type: T/T,Paypal
Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW
Min. Order: 500 Piece/Pieces
Transportation: Land,Air,Express
Port: Shenzhen Port,Hongkong Port

Supply Ability & Additional Information

Additional Information

Packaging: Export carton

Productivity: 100,000 pcs/month

Transportation: Land,Air,Express

Place of Origin: Hunan,China

Supply Ability: 500,000pcs/month

Certificate: RoHS,REACH

HS Code: 8547100000

Port: Shenzhen Port,Hongkong Port

Payment Type: T/T,Paypal

Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW

Product Attributes

Model No.: As per customer's specification

Brand: Jinghui ceramics

Place Of Origin: China

Types Of: Dielectric Ceramics, Insulating Ceramics

Material: Alumina, Zirconia

Features: Excellent Insulation, Heat Dissipation

Certificate: ISO9001:2015, RoHS, REACH

Tolerance: Thickness To Be 0.02mm After Lapping

Color: White, Pink, Balck, Ivory Optional

Purity Option: 94.4% 95%, 99% Or 99.5% Alumina

Precision Process: Lapping,Laser Scribing and Cutting

Application: For Power Electronic Modules

Packaging & Delivery

Selling Units:	Piece/Pieces
Package Type:	Export carton
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Product Description

Laser Cutting 1mm 96% Alumina Ceramic Wafer The description The ceramic wafer is made out of 96% aluminum oxide, but 99%, 99.6% purity optional as per specific application's requirement. The regular forming process is type casting when the thickness of Ceramic Substrate less than 1.2mm. It's easy to achieve the different pattern, different shape with high dimensional accurancy by laser cutting, laser scribing. On the other hand, the forming process will be dry pressing and isostatic...

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Category: Bare Ceramic Substrate

 Products> Ceramic Substrate> Bare Ceramic Substrate> Laser Cutting 1mm 96% Alumina Ceramic Wafer