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Bare Ceramic Substrate
Bare Ceramic Substrates refer to ceramic substrates without circuits. They have advantages like high-temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to components. They are often used as functional Ceramic Components in various hybrid integrated circuits, high-power modules, smart power semiconductors, automotive electronics, etc. At the same time, the problem we cannot ignore is that the Ceramic Substrate is relatively brittle, its size is limited, and the cost is relatively high.
Currently, the ceramic substrates on the market mainly use high-purity alumina ceramics, aluminum nitride ceramics, Silicon Nitride ceramics, and Silicon Carbide Ceramics as raw materials. Each has its advantages and areas of application.
We mainly use tape casting or dry pressing forming processes to produce bare ceramic substrates. Our standard thicknesses include 0.25 / 0.30 /0.40 / 0.50 / 0.635 / 0.80 / 1.0mm, etc. In addition, we can provide customers with customized services through secondary processing processes such as laser scribing, laser cutting, and precision machining.
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Unit Price:0.5~10USDBrand:Jinghui ceramicsMin. Order:Piece/PiecesModel No:JJBP-0111-0003Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:ChinaAs Fired / Lapped / Polished 96% Alumina Ceramic Substrate Product Introduction 1. 96% Alumina (Al2O3) is one of the most popular ceramic substrate materials because of its excellent heat resistance, high mechanical strength, abrasion resistance,... -
Unit Price:0.65~10USDBrand:Jinghui ceramicsMin. Order:Piece/PiecesModel No:JJBP-0141-0015Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:ChinaUltra Thin 0.1-0.2mm AlN Lapped Aluminum Nitride Substrate Why Choose the Aluminum Nitride Ceramic Substrate? The aluminum nitride ceramic substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant and... -
Unit Price:0.85~20USDBrand:Jinghui ceramicsMin. Order:Piece/PiecesModel No:JJBP-0111-0008Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:ChinaAbout Laser Cutting Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle. Conventional processing methods will generate stress during... -
Unit Price:USD 2 - 10 / Piece/PiecesBrand:Jinghui CeramicModel No:CustomizedTransportation:Ocean,Land,Air,ExpressPackaging:Export cartonSupply Ability:500,000 Pieces/monthPlace of Origin:ChinaProductivity:500,000 Pieces/monthY-TZP Insulation ZrO2 Zirconia Ceramic Substrate Zirconia ceramic substrate has the characteristics of high safety and reliability, high density, high mechanical properties, high thermal load performance, low dielectric loss and other... -
Unit Price:0.5~100USDBrand:Jinghui CeramicMin. Order:Piece/PiecesModel No:JJBP-0141-0013Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:China0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride AlN Substrate Product Introduction With the continuous development of power devices (including LED, LD, IGBT, CPV, etc.), heat dissipation has become a key technology that affects device performance and... -
Unit Price:USD 26 - 30 / Piece/PiecesBrand:Jinghui ceramicsTransportation:Ocean,Land,Air,ExpressPackaging:Individual packagingSupply Ability:200,000pcs/monthPlace of Origin:Made-in-ChinaProductivity:100,000pcs monthlyPolished 99.6% Alumina Thin-flim Ceramic Substrates Generally, the substrate is the base for building thin-flim subassembly. The quality of ceramic substrates will play a role to influence the quality of finished thin-flim circuit. Hence, it... -
Unit Price:0.5~100USDBrand:Jinghui CeramicMin. Order:Piece/PiecesModel No:JJBP-0141-0014Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:ChinaMirror Polishing Aluminum Nitride AlN Ceramic Substrate PCB The Role of Mirror Polishing The main purpose of lapping and polishing is to remove the attachments on the substrate surface, improve the flatness, and obtain a thinner metallization layer.... -
Unit Price:0.5~100USDBrand:JinhuiMin. Order:OthersModel No:JJBP-0141-0001Transportation:Ocean,Land,Air,ExpressPackaging:Individual PackagePlace of Origin:ChinaLaser Scribing Aluminum Nitride Plate AlN Ceramic Substrate Introduction of Aluminum Nitride Ceramic Substrates Aluminum nitride (AlN) is an advanced ceramic material commonly used in bare ceramic substrate. It has two very critical characteristics:... -
Unit Price:0.5~100USDBrand:Jinghui ceramicsMin. Order:Piece/PiecesModel No:JJBP-0141-0013Transportation:Air,Express,Ocean,LandPackaging:Individual PackagePlace of Origin:ChinaCharacteristics of Aluminum Nitride Ceramic Substrate (1) Superb high thermal conductivity, 6 times that of high purity alumina ceramic at least. (2) The CTE ((4-6)×10-6/℃)) matches that of semiconductor silicon material (2.8×10-6/℃). (3) Good...
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Type 1
Alumina Substrates
Alumina ceramic substrate is the most widely used ceramic substrate material. Common ones are 99.6% alumina substrate and 96% alumina substrate. The former is generally suitable for thin film circuits, while for thick film circuits, 96% alumina substrate can meet its process requirements.
Type 2
Zirconia Substrates
Zirconia ceramics have sensitive electrical properties, so zirconia substrates are often used in fields such as oxygen sensors, solid oxide fuel cells, and high-temperature heating elements.
Type 3
Silicon Nitride Substrates
Compared with alumina substrates and zirconia substrates, silicon nitride substrates have higher thermal conductivity. Its thermal expansion coefficient is small, close to that of semiconductor chips (Si, SiC), and has good thermal matching, making it suitable for demanding semiconductor fields.
Type 4
Aluminum Nitride Substrates
Aluminum nitride substrates have high thermal conductivity (6-10 times that of aluminum oxide substrates) and low dielectric constant, making them very suitable for high-frequency and high-power applications, as well as applications with extremely high heat dissipation requirements.