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Products> Ceramic Rods> Zirconia Chip Ceramic Bonding Tool for Semiconductor
Zirconia Chip Ceramic Bonding Tool for Semiconductor
Zirconia Chip Ceramic Bonding Tool for Semiconductor

Zirconia Chip Ceramic Bonding Tool for Semiconductor

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    • Payment Type: T/T,Paypal,Money Gram,Western Union
    • Incoterm: FOB,CIF,FCA
    • Min. Order: 5000 Piece/Pieces
    • Transportation: Ocean,Land,Air,Express
    • Port: Shenzhen,Hongkong
    Supply Ability & Additional Information
    Additional Information

    PackagingExport carton

    Productivity100,000pcs/month

    TransportationOcean,Land,Air,Express

    Place of OriginChina

    Supply Ability2,000,000 pieces/month

    CertificateRoHS

    PortShenzhen,Hongkong

    Payment TypeT/T,Paypal,Money Gram,Western Union

    IncotermFOB,CIF,FCA

    Product Attributes

    Model No.JH.SC.009

    BrandJinghui ceramics

    Place Of OriginChina

    SpeciesCeramic Rods

    ApplicationIndustrial Ceramic

    MaterialAlumina Ceramic

    Surface TreatmentPolishing

    Precision ProcessFine Grinding

    Materialzirconia

    ColorWhite

    Typical Tolerance0.01mm

    SpecificationMin. OD 1mm, Max.50mm Capability

    FeaturesSuperior Mechanical Strength

    ApplicationWork As Guide Pin

    Packaging & Delivery
    Selling Units: Piece/Pieces
    Package Type: Export carton

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    Product Description
    Zirconia Ceramic Chip Bonding tool for Semiconductor Ceramic bonding tools is often made from zirconia ceramic (ZrO2), and characteristic by their ultra-small, high precision injection hole, better surface finish and longer lives. In the early stage, the bonding tools were made out of iron, the biggest weakness of iron is easy to wear out, the quick wear rate will shorten the working life and increase the maintenance times. In addition, iron bonding tools can’t anti-static...
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    Category: Ceramic Rods
    Products> Ceramic Rods> Zirconia Chip Ceramic Bonding Tool for Semiconductor
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