 Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bond Copper DBC Ceramic Substrate for PCB

Direct Bond Copper DBC Ceramic Substrate for PCB

$5
≥100 Set/Sets

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Payment Type: T/T,Paypal,Western Union
Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
Min. Order: 100 Set/Sets
Transportation: Ocean,Land,Air
Port: Shenzhen Port,Hongkong Port

Supply Ability & Additional Information

Additional Information

Packaging: Export carton

Productivity: 100,000 sets/month

Transportation: Ocean,Land,Air

Place of Origin: China

Supply Ability: 500,000 sets/month

Certificate: RoHS

Port: Shenzhen Port,Hongkong Port

Payment Type: T/T,Paypal,Western Union

Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP

Product Attributes

Model No.: Customized

Brand: Jinghui ceramics

Color: White

Max. Overall Length: 100mm

Tolerance: Best To Be 0.01mm

Max. OD: 100mm

Min. Wall Thickness: 0.3mm

Precision Process: Fine Grinding,maching,laser Cutting

Certificate: ISO9001:2008, SGS

Features: Excellent Insulation, Heat Dissipation

Application: Ceramic Circuit Board

Material: 95% Alumina, AlN Ceramics

Packaging & Delivery

Selling Units:	Set/Sets
Package Type:	Export carton

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Product Description

Direct Bond Copper DBC Ceramic Substrate for PCB Given the properities of good heat transfer properties, vacuum tightness and minimum electric resistance, alumina Metallized Ceramics are an ideal components for high vacuum ,high voltage and high pressure applications. By applying a thin metallic coating(general Mo/Mn), by then following covered with plating, like Nickel/Copper/Gold...to the surface of the ceramic,, the welding between ceramic and metal can be achieved, which is also known...

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Category: Metallized Ceramic Substrate

 Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bond Copper DBC Ceramic Substrate for PCB