 Products> Ceramic Substrate> Metallized Ceramic Substrate> DCB / DBC Ceramic Substrate Direct Copper Bonding

DCB / DBC Ceramic Substrate Direct Copper Bonding

$1-100 /Piece/Pieces

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Payment Type: T/T,Paypal,L/C,Credit card
Incoterm: FOB,CIF,EXW,FCA,DDP,DDU
Min. Order: 100 Piece/Pieces
Transportation: Ocean,Land,Air,Express
Port: Shenzhen

Supply Ability & Additional Information

Additional Information

Packaging: Vacuum Packaging

Transportation: Ocean,Land,Air,Express

Place of Origin: China

Certificate: RoHS

HS Code: 8547100000

Port: Shenzhen

Payment Type: T/T,Paypal,L/C,Credit card

Incoterm: FOB,CIF,EXW,FCA,DDP,DDU

Product Attributes

Model No.: Customized

Brand: Jinghui ceramics

Place Of Origin: China

Species: Ceramic Plates

Application: Industrial Ceramic

Finished Product: Ceramic Circuit Board

Substrate Material: 96%, 99.6% Alumina

Surface Metallization Process: Direct Bonded Copper ( DCB / DBC) Technology

Feature: Strong Bonding Strength between Ceramic and Metal

Usage: To Realize Electrical Connections

Packaging & Delivery

Selling Units:	Piece/Pieces
Package Type:	Vacuum Packaging

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Product Description

DCB / DBC Ceramic Substrate Direct Copper Bonding Principle of Direct Bonded Copper DBC Ceramic Substrate Oxygen is added between copper and ceramic to obtain a Cu-O eutectic liquid at a temperature of 1065-1083°C, and then react to obtain an intermediate phase (CuAIO2 or CuAI2O4), thereby realizing chemical metallurgy bonding between Cu layer and Bare Ceramic Substrate which is regularly made out of alumina ceramics, aluminum nitride ceramic and so on. Finally, the photolithography...

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Category: Metallized Ceramic Substrate

 Products> Ceramic Substrate> Metallized Ceramic Substrate> DCB / DBC Ceramic Substrate Direct Copper Bonding