Ceramic Substrate

Compared with traditional resin, metal, and metal-based composite substrates, Ceramic Substrates have unmatched electrical and thermal properties. The Ceramic Components can greatly improve the reliability of devices and extend their service life. Therefore, ceramic substrates are widely used in high-power power electronic circuits, electronic chip packaging, high-frequency switching power supplies, automotive electronics, photovoltaic power generation, solid-state relays, high-power LED lighting products, communication antennas, automotive sensors, and refrigeration sheet.

As a trusted Ceramic Substrate manufacturer, we can provide ceramic substrates with different standard specifications:

1. Alumina Substrate

Making various standard thick film ceramic substrates in 96% alumina and thin film ceramic substrates in 99.6% alumina. They are the most cost-effective and most widely used substrate.

2. Aluminum Nitride Substrate

The most prominent strength is its thermal conductivity and fast heat-dissipation. Some selections of different thermal conductivity from standard 170W/m.K to 230 W/m.k availability.

3. Silicon Nitride Substrate

Besides standard sizes with 190 x 140mm, also supply smaller sizes via laser cutting or machining cutting. This kind of substrate has exceptional thermal shock and mechanical strength in all equivalent products.

With our integrated manufacturing capabilities, tape casting, lapping, laser scribing, laser cutting, machining can be performed in-house facility. Furthermore, the polishing finish and surface metallizing can be done by ourselves. So, it's a easy job to custom your ceramic substrate

If you have project or business that need ceramic substrate, please contact us. Then, explore how we can help you to get your optimized solution for your devices.

There are 65 products

Bare Ceramic Substrate

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Metallized Ceramic Substrate

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WHAT WE DO

Ceramic substrates are mainly used as hybrid circuit substrates, thin film circuit substrates, and heat dissipation substrates for chip packaging.

We mainly supply 95% alumina substrates, 99% alumina substrates, and aluminum nitride substrates. Their thickness can be customized according to your needs. They can be laser cut, drilled, or scribed. The substrate can be metallized to form circuit patterns.

We strictly control each process parameter during the manufacturing process to ensure that the quality and performance of the final product meet the requirements.

As-Fired Alumina Ceramic Substrate

Laser Scribing Alumina Substrate

Fine Grinding Ceramic Substrate

Aluminum Nitride AlN Vacuum Plate

PRODUCTION PROCESS

The production process of bare ceramic substrates is mainly tape casting. If used as electronic packaging materials, the bare ceramic substrates also need to be metallized to deposit a metal layer on the ceramic substrate.

MATERIAL PROPERTIES OF CERAMIC SUBSTRATES

Values may vary depending on the specific product.

AVAILABLE SIZES

Type 1: Thick Film Ceramic Substrates

The purity of alumina is generally 96%. Available in different sizes or shapes, suitable for thick film circuits.

For products that require higher dimensional accuracy, laser processing can be used for subsequent processing after firing.

96% Alumina Substrate

The most commonly used ceramic substrate

As-Fired / Lapped / Polished

To meet your different needs

Dimensional Tolerance

Length and Width Tolerance:
±2mm (standard);
±0.15mm (by laser cutting)

Thickness Tolerance:
T<0.3mm, ±0.03mm (standard); ±0.01mm (best)
T=0.3-1.0mm, ±0.05mm (standard); ±0.01mm (best)
T>1.0mm, ±10% (standard); ±0.01mm (best)
(T refers to Substrate Thickness)

Hole Tolerance:
φ≤0.5mm, ±0.08mm (standard)
φ>0.5mm, ±0.2mm (standard)
(φ refers to Hole Diameter)
Surface Roughness

Lapped: Ra 0.3-0.7μm
Polished: Ra ≤0.05μm
Laser Scribe Line Depth

T=0.2-0.3mm, T*40%±5%
0.3mm<T≤0.5mm, T*50%±3%
0.5mm<T≤1.0mm, T*43%±3%
T=1.2mm, T*55%±3%
T=1.5mm, T*55%±3%
T=2.0mm, T*55%+10%
(T refers to Substrate Thickness)

Type 2: Thin Film Ceramic Substrates

The high purity and smaller grain size of 99.6% alumina ceramics make the material smoother, with fewer surface defects and extremely small surface roughness, making it the first choice for manufacturing thin-film circuit substrates.

99.6% Alumina Substrate

Super smooth substrate

As-Fired / Lapped / Polished

To meet your different needs

Dimensional Tolerance

Length and Width Tolerance:
±2mm (standard);
±0.15mm (by laser cutting)

Thickness Tolerance:
T<0.3mm, ±0.03mm (standard); ±0.01mm (best)
T=0.3-1.0mm, ±0.05mm (standard); ±0.01mm (best)
T>1.0mm, ±10% (standard); ±0.01mm (best)
(T refers to Substrate Thickness)

Hole Tolerance:
φ≤0.5mm, ±0.08mm (standard)
φ>0.5mm, ±0.2mm (standard)
(φ refers to Hole Diameter)
Surface Roughness

Lapped: Ra 0.1-0.5μm
Polished: Ra ≤0.05μm
Laser Scribe Line Depth

T=0.2-0.3mm, T*40%±5%
0.3mm<T≤0.5mm, T*50%±3%
0.5mm<T≤1.0mm, T*43%±3%
T=1.2mm, T*55%±3%
T=1.5mm, T*55%±3%
T=2.0mm, T*55%+10%
(T refers to Substrate Thickness)

Type 3: High Thermal Conductivity Ceramic Substrate

Aluminum nitride (AlN) is increasingly used as a substrate for ceramic printed circuit boards in high-power modules such as IGBTs, electronic drivetrains, power management modules, specialty lighting, on-board chargers or in environments requiring extremely low operating temperatures, such as quantum computing, superconductors, cryogenic refrigerators.

AlN Substrate

For high power hybrid semiconductor packaging

As-Fired / Lapped / Polished

To meet your different needs

Features

Dimensional Tolerance

Length and Width Tolerance:
±2mm (standard);
±0.15mm (by laser cutting)

Thickness Tolerance:
T<1.0mm, ±0.03mm (standard); ±0.01mm (best)
1.0mm≤T<1.5mm, ±0.05mm (standard); ±0.01mm (best)
T≥1.5mm, ±0.07mm (standard); ±0.01mm (best)
(T refers to Substrate Thickness)

Hole Tolerance:
φ≤0.5mm, ±0.08mm (standard)
φ>0.5mm, ±0.2mm (standard)
(φ refers to Hole Diameter)
Surface Roughness

Lapped: Ra 0.3-0.7μm
Polished: Ra ≤0.05μm
Laser Scribe Line Depth

T=0.2-0.3mm, T*40%±5%
0.5mm<T≤1.0mm, T*50%±3%
1.0mm<T≤1.2mm, T*55%±3%
1.2<T≤1.5mm, T*60%±3%
T=2.0mm, T*45% (Extreme Depth)
(T refers to Substrate Thickness)