Ceramic Substrate

Ceramic Substrates are skinny sheets made from Advanced Ceramics. The materials used mainly include aluminum oxide (Al2O3), aluminum nitride (AlN), Silicon Nitride (Si3N4), zirconium oxide (ZrO2), and zirconium toughen alumina (ZTA).

Compared with traditional resin and metal substrates, ceramic substrates have higher electrical insulation, high thermal conductivity, mechanical strength, corrosion and erosion resistance, and unmatched high-temperature stability. The following is a comparison table of several typical material properties for reference, and you can determine which material is more suitable for your needs and applications.

Material	Flexural strength （MPa）	Fracture toughness (MPam^1/2)	Thermal expansivity (10^-6/K)	Thermal conductivity (W/m.K)	Dielectric strength (KV/mm)
Al2O3	≧380	≧4.3	6.6~7.5	≧24	≧15
AlN	≧450	≧4.0	4.4~4.8	≧180	≧17
Si3N4	≧700	≧6.7	2.7~4.0	≧80	≧20
ZrO2	≧800	≧6.5	8.0~9.5	≧3	≧10
ZTA	≧625	≧5.0	7.0~9.0	≧26	≧25

Due to the great combination of ceramic substrates' thermal, insulating, mechanical, and chemical properties, they have been extensively used in consumer electronics, LED substrates, automotive, telecommunications, power generation, medical, semiconductor packaging, etc.

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Bare Ceramic Substrate

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Metallized Ceramic Substrate

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Alumina Al2O3 Substrate

● The highest price to performance in the ceramic substrates’ family

● High-temperature resistance and acids & alkalis resistance

● The most widely used in high-performance electrical & electronics

● Typical applications: LED power lighting, high-powder modules, power control circuits, power mixing circuits, intelligent power modules, and solar panel components

Aluminum Nitride AlN Substrate

● Unmatched thermal conductivity advantage and fast heat dissipation, also non-toxic than beryllium oxide

● Almost similar thermal expansion coefficient (CTE) as Si and GaAs chip

● Typical applications: High-end packaging ceramics, Heat exchangers, 5G communications, cutting-edge semiconductors, aerospace

Silicon Nitride Si3N4 Substrate

● Supreme high flexural strength and fracture toughness than all others

● Extreme high thermal shock resistance performance up to 1000℃

● Excellent wear resistance and durability in various harsh conditions

● Typical applications: including engine control, sensors, and shock absorbers of auto parts, as well as Intelligent electronic equipment, traction systems, etc

Zirconia ZrO2 Substrate

● Greatest heat insulation and thermal isolation

● Higher density and high fracture toughness in the same type of products

● High density than other technical ceramics and exceptional abrasive resistance

● Typical applications: Electronics, fiber optical communication, packaging ceramics, bearing, and medical

Available In-housing Post-Processing

Lapping and polishing are usually utilized to improve the flatness, roughness, cleanliness, and dimensional accuracy of ceramic substrates in devices to enhance their functional performance and reliability and achieve precision fitting requirements.

In most applications, bare ceramic substrates cannot be used as direct components in the devices. Ceramic metallization is an excellent bridge to solve this challenge. After metalizing, ceramic substrates can provide the following functions:
1. Ideal electrical conductivity with collaborated metal parts

2. Higher stability and reliability of packaging performance

3. Better matching thermal conductivity and thermal expansion coefficient with chips

Laser cutting, laser scribing, and mechanical machining are mostly post-processing techniques used for ceramic substrates to coordinate with customized metalizing patterns or bespoke configurations.

The above processing can be carried out at our facility, and the prototyping samples to bulk productions is easy to realize shortly. We do believe you can find an amazing solution per your customized requirements.

Polished Substrate

Scribed Substrate

Machined Substrate

Metalized Substrate

We mainly use tape casting to make bare ceramic substrates.

Here is our process flow.

Manufacturing Process OF Bare Ceramic Substrate

If used as electronic packaging materials, the bare ceramic substrates also need to be metallized to deposit a metal layer on the ceramic substrate.

Available Typical Types and Sizes

Type 1: Thick Film Ceramic Substrates

Thick film ceramic substrates are generally 96% alumina. They are available in different dimensions with custom thicknesses or shapes and are suitable for thick film circuits.

For products that require higher dimensional accuracy, laser processing can be used for subsequent processing after firing.

96 Alumina Substrate

The most commonly used ceramic substrate

As-Fired / Lapped / Polished / Metallized

To meet your different needs

Type 2: Thin Film Ceramic Substrates

The high purity and smaller grain size of 99.6% alumina ceramics make the material smoother, with fewer surface defects and superb quality surface roughness, making it the first choice for manufacturing thin-film circuit substrates.

99.6% Alumina Substrate

Super smooth substrate

As-Fired / Lapped / Polished

To meet your different needs

Type 3: High Thermal Conductivity Ceramic Substrate

Aluminum nitride (AlN) is increasingly used as a substrate for ceramic printed circuit boards in high-power modules such as IGBTs, electronic drivetrains, power management modules, specialty lighting, on-board chargers, or in environments requiring extremely low operating temperatures.

Custom-made structures into AlN substrates are sometimes essential to fit with other components; therefore, machining or laser cutting is conducted with it.

AlN Substrate

For high power hybrid semiconductor packaging

As-Fired / Lapped / Polished

To meet your different needs